Detection research of telecentric bright field imaging system based on multi-angle illumination in ultra-precision machining components
1
Moral Education • Integrated Teaching and Research Training Department, Jilin Provincial Institute of Education, Changchun 130000, China
Submission date: 2024-04-11
Final revision date: 2024-09-27
Acceptance date: 2024-12-11
Online publication date: 2025-01-06
Publication date: 2025-01-06
Corresponding author
Zhuolin Li
Moral Education • Integrated Teaching and Research Training Department, Jilin Provincial Institute of Education, Changchun 130000, China
Moral Education • Integrated Teaching and Research Training Department, Jilin Provincial Institute of Education, Changchun 130000, China
KEYWORDS
Component surface propertiesbright field imagingvisual differential excitationthe Fourier Transformdefect segmentation
TOPICS
ABSTRACT
Due to the rapid development of industrial automation and intelligence, the performance requirements of the machine vision inspection system are increased, especially for the surface of components with different properties. Firstly, the detection of single-sided polished optical element surface based on coaxial incidence telecentric bright field imaging system is proposed, and the upper and lower surfaces with different properties are compared. Secondly, the gray value change of defect location is distinguished, and then different scratch defect information is extracted. Finally, the detection data of the sample is calculated, and the weak information extraction algorithm based on visual difference excitation and double discrete the Fourier Transform is proposed. The average diameter of the sample is 6109.50 pixels, the average nominal value is 101.60 mm, the scratch pixel length and width are 184 pixels and 7.23 pixels respectively, and the actual length and width are 3.06 mm and 0.12 mm, respectively. The experimental results show that the detection technology of weak defects on the surface of single-sided polished optical elements can realize the nondestructive automatic quantitative detection of sapphire substrate, and can provide theoretical reference and technical support for the development of intelligent industrial applications.
FUNDING
This research received no external funding.
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